Eurofins Digital Testing has launched updated testing services for the new CI Plus 2.0 standard.
Eurofins is the exclusive test partner for version 2.0 of the standard, appointed by CI Plus LLP (the Trust Authority for the CI
Plus standard) and featuring representatives from Sony, Samsung, TP Vision, Panasonic, Neotion and SMiT. The LLP announced CI Plus 2.0 Host Device Registration for licensees commenced from 20 July 2020.
The CI Plus testing services from Eurofins provides the official CI Plus LLP 2.0 Certification Testing, including CI Plus ECP
certification testing for device licensees and testing services for semiconductor and DVB software suppliers who have a CI Plus or CI Plus ECP component license.
Eurofins will also support hosting services which require debug and retesting support. To deliver test services the official CI Plus 2.0 test tool and materials are used to ensure conformance to the latest specifications.
The CI Plus standard is an enhanced security system that allows manufacturers, operators and broadcasters to deliver secure content on digital TV receivers via the Common Interface (CI) and Conditional Access Module (CAM). The Next-Gen CI Plus 2.0 specification adds a USB-form factor, whereby consumers can receive Pay-TV services by
leveraging USB-based CAMs.
Johan Craeybeckx, Business Line Director, Eurofins Digital Testing International said: “As the exclusive CI Plus LLP approved test partner, we are delighted to launch official CI Plus testing services and look forward toproviding a range conformance testing services for the standard.
“The CI Plus 2.0 USB interface provides an easy-to-use, familiar form factor for consumers, manufacturers and operators alike. Leveraging Eurofins’ automated test tools for the required testing of USB hosts and compatible-devices will streamline build processes and greatly reduce time to market.”
Vlaho Kostov, Chairman, CI Plus LLP said of the release of the CI Plus 2.0 testing services: “CI Plus LLP Welcomes this development by Eurofins representing an exciting evolution of CI Plus into the new USB form factor for a next phase of market deployment.”
