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Broadcom puts Fon into DOCSIS chips

November 19, 2010 10.44 Europe/London By Julian Clover

Wi-fi sharing technology Fon is to become a standard feature in Broadcom’s DOCSIS 3.0 cable modem and gateway system-on-a-chip solutions.

The chip supplier is to include a software development kit (SDK) that enables manufacturers to build Fon functionality directly into their customer premises equipment (CPEs) without any additional development.

“Fon has built a Wi-fi network with over 2.5 million hotspots, and Telcos, ISPs and manufacturers are increasingly looking for ways to give their customers access to it,” said Alex Puregger, Fon’s COO.

The SDK will allow manufacturers to customize new CPEs and easily upgrade their installed base of products. “Fon’s Wi-fi network will enable consumers to use and share their Wi-fi connection securely to enjoy videos, movies and games using only a small portion of their overall bandwidth,” said Brian Wheeler, Senior Product Line Manager at Broadcom.

Fon currently has agreements with telcos and ISPs including British Telecom, Comstar-MTS Russia, SFR, and ZON Portugal. In return for sharing their Wi-fi through Fon, participants can use the operator’s extended network of Hotspots. It also allows them to get a return of 50% of the fee charged by sharing their Wi-fi connection.

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Filed Under: Newsline, Tech Tagged With: Broadcom, DOCSIS 3.0, Fon Edited: 19 November 2010 10:44

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About Julian Clover

Julian Clover is a Media and Technology journalist based in Cambridge, UK. He works in online and printed media. Julian is also a voice on local radio. You can talk to Julian on X @julianclover, or by email at jclover@broadbandtvnews.com.

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